Thermal Management Materials for Electronic Packaging
Summarizes the development of thermal management materials and introduces the preparation methods and application scenarios of thermal management materials for electronic packing.
| ISBN: | 9783527352425 |
|---|---|
| Auflage: | 1 |
| Sprache: | Englisch |
| Seitenzahl: | 368 |
| Produktart: | Gebunden |
| Herausgeber: | Tian, Xingyou |
| Verlag: | Wiley-VCH |
| Veröffentlicht: | 17.01.2024 |
| Untertitel: | Preparation, Characterization, and Devices |
| Schlagworte: | Components & Devices Electrical & Electronics Engineering Electronic Materials Elektronische Materialien Elektrotechnik u. Elektronik Halbleiterphysik Komponenten u. Bauelemente Materials Science Materialwissenschaften Physics |
Professor Xingyou Tian is Deputy Director of Institute for Solid State Physics (ISSP), Hefei Institutes of Physical Science, Chinese Academy of Sciences and Director of the Key Laboratory of Photovoltaic and Energy-Saving Materials of the Chinese Academy of Sciences. His main research include key functional materials for electronic devices, integrated circuit heat dissipation materials, polymer nanocomposite materials, and new energy-saving and environmentally friendly materials.